JPH0142591B2 - - Google Patents
Info
- Publication number
- JPH0142591B2 JPH0142591B2 JP9646983A JP9646983A JPH0142591B2 JP H0142591 B2 JPH0142591 B2 JP H0142591B2 JP 9646983 A JP9646983 A JP 9646983A JP 9646983 A JP9646983 A JP 9646983A JP H0142591 B2 JPH0142591 B2 JP H0142591B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- cylindrical capacitor
- hole
- capacitor
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 71
- 238000000034 method Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000011295 pitch Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 10
- 239000011888 foil Substances 0.000 description 7
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9646983A JPS59219884A (ja) | 1983-05-30 | 1983-05-30 | コンデンサ付端子板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9646983A JPS59219884A (ja) | 1983-05-30 | 1983-05-30 | コンデンサ付端子板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59219884A JPS59219884A (ja) | 1984-12-11 |
| JPH0142591B2 true JPH0142591B2 (en]) | 1989-09-13 |
Family
ID=14165893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9646983A Granted JPS59219884A (ja) | 1983-05-30 | 1983-05-30 | コンデンサ付端子板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59219884A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61227386A (ja) * | 1985-04-01 | 1986-10-09 | 第一電子工業株式会社 | グランド端子板を有する多極コネクタおよびその作成方法 |
| JPH0265113A (ja) * | 1988-08-31 | 1990-03-05 | Taiyo Yuden Co Ltd | 貫通コンデンサ組及びその製造方法 |
-
1983
- 1983-05-30 JP JP9646983A patent/JPS59219884A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59219884A (ja) | 1984-12-11 |
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